IVC-3D31111_SICK_PRODUCT_Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司

The IVC-3D31111 is a high-performance 3D smart camera from SICK, designed for advanced industrial automation applications requiring precise dimensional measurement, object recognition, and quality inspection.

400-887-3214

DESCRIBE

Key Features:
3D Imaging Technology:

High-resolution 1280×1024 pixels

Laser-based triangulation for accurate depth measurement

Z-axis resolution down to <10μm

Processing Power:

Integrated Intel® processor for onboard analysis

Pre-installed measurement tools (gap, height, volume, etc.)

Industrial Connectivity:

Gigabit Ethernet (GigE Vision)

PROFINET, EtherNet/IP options

Digital I/O (4 inputs/4 outputs)

Robust Design:

IP65 protection rating

Compact 90×90×150 mm housing

-10°C to +50°C operating range

Technical Specifications:
Measurement Range: Up to 300mm (adjustable)

Measurement Speed: Up to 10,000 profiles/second

Laser Class: Class 1 (eye-safe)

Power Supply: 24V DC (±10%)

Software: SICK Inspector P (intuitive configuration interface)

Typical Applications:
✔ Automated dimensional inspection
✔ Weld seam quality control
✔ Packaging volume measurement
✔ Robotic bin picking guidance
✔ Tire tread inspection

SERVICE HOTLINE 400-887-3214

Mail jilineasyyi@outlook.com ADDRESS Unit 12, 20th Floor, Good View Commercial Centre, 2-16 Garden Street, Mong Kok, Hong Kong

Q Q： 615739355

Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司吉ICP备2024020526号-1