The OLM200-1009 represents SICK's next-generation optical length measurement technology, delivering unparalleled precision for the most demanding industrial applications. This ultra-high-performance system combines advanced photonics with intelligent signal processing to achieve sub-micron measurement accuracy in challenging production environments.
Advanced Technical Specifications
Feature Specification
Optical System Multi-spectral hybrid laser/LED array
Detection Method Phase-shift interferometry + triangulation
Data Interfaces 10G Ethernet, PROFINET IRT, EtherCAT G
I/O System 16 configurable high-speed I/O channels
Power System 24V DC with PoE++ (IEEE 802.3bt)
Environmental Rating IP69K + NEMA 6P
Mechanical Design Titanium-reinforced composite housing
Operating Range -40°C to +85°C
Industry 4.0 Ready
Embedded edge computing with AI accelerator
Digital twin integration via OPC UA
Cybersecurity (IEC 62443 compliant)
Predictive analytics with ML algorithms
Wireless firmware updates
Application Excellence
✔ Nanotechnology material production
✔ Semiconductor ribbon processing
✔ Aerospace-grade composite fabrication
✔ Medical device manufacturing
✔ High-speed packaging 4.0 systems