IVC-3D31111 _SICK_PRODUCT_Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司

The IVC-3D31111 is a high-precision 3D smart camera from SICK, designed for advanced industrial inspection and automated measurement applications. Combining laser triangulation with intelligent onboard processing, this system delivers micron-level accuracy for quality control and robotic guidance.

400-887-3214

DESCRIBE

Key Features
3D Imaging Performance
High-resolution 1280×1024 pixels

Z-axis resolution: <10μm

Measurement range: Up to 300mm (adjustable)

Scan rate: 10,000 profiles/second

Laser class: 1 (eye-safe)

Processing Power
Integrated Intel processor for real-time 3D analysis

Pre-installed measurement tools:

Height/depth measurement

Volume calculation

Gap/step detection

Surface defect identification

Industrial Design
IP65 protection rating

Compact housing: 90×90×150mm

-10°C to +50°C operating range

Vibration resistant (5g)

Technical Specifications
Parameter Specification
Measurement Principle Laser triangulation
XY Resolution Up to 20μm
Interface GigE Vision
I/O Configuration 4 DI/4 DO
Power Supply 24V DC (±10%)
Weight 1.2 kg
Typical Applications
✔ Automated weld seam inspection
✔ Precision component measurement
✔ Tire tread analysis
✔ Electronics assembly verification
✔ Robotic bin picking guidance

SERVICE HOTLINE 400-887-3214

Mail jilineasyyi@outlook.com ADDRESS Unit 12, 20th Floor, Good View Commercial Centre, 2-16 Garden Street, Mong Kok, Hong Kong

Q Q： 615739355

Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司吉ICP备2024020526号-1