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330707-00-62-10-01-00
330707-00-62-10-01-00 Product Brief High-Density Military-Grade Connector Core Features: ✔ 62-Position in compact 78.4×32.6mm footprint ✔ Extreme Environment -55°C to +125°C operation ✔ Gold-Flash Contacts ≤15mΩ resistance ✔ IP67 Sealed when mated ✔ 10,000+ Cycles military-grade durability Technical Highlights: Voltage/Current: 250V AC/DC, 3A per contact Materials: Housing: High-temp LCP (UL94 V-0) Contacts: Beryllium copper (Au flash) Vibration/Shock: 15G/100G rated Pitch: 1.27mm high-density Certifications: UL 1977 | IEC 61076-2-101 | MIL-STD-202G | RoHS 3 Key Advantages: Mission-Critical Reliability - Exceeds aerospace requirements Signal Integrity - Controlled impedance design Space-Saving - High contact density Applications: ◼ Avionics systems ◼ Battlefield comms equipment ◼ Industrial robotics ◼ High-speed data transmission Order Options: Standard: 50 units/tray Custom configurations (-XX suffix) 6-8 week lead time Why This Model?
400-887-3214
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330707-00-62-10-01-00 Technical Specifications
Product Identification
Attribute Detail
Full Model Number 330707-00-62-10-01-00
Product Line High-Density Interconnect System
Revision 00 (Initial Release)
Key Parameters
Electrical Characteristics
Parameter Specification
Operating Voltage 250V AC/DC
Current Rating 3A per contact
Contact Resistance ≤15mΩ
Insulation Resistance ≥1000MΩ
Dielectric Strength 1500V AC, 60s
Mechanical Specifications
Feature Detail
Housing Material High-Temp LCP (UL94 V-0)
Contact Material Beryllium Copper (Au Flash)
Number of Positions 62
Mating Cycles 10,000+
Insertion Force 35N max
Environmental Ratings
Condition Performance
Operating Temperature -55°C to +125°C
Vibration Resistance 10-2000Hz, 15G
Shock Resistance 100G, 6ms
IP Rating IP67 (when mated)
Physical Dimensions
Dimension Value (mm) Tolerance
Length 78.4 ±0.25
Width 32.6 ±0.15
Height 22.8 ±0.10
Pitch 1.27mm -
Certifications & Compliance
UL 1977 Recognized
IEC 61076-2-101 Compliant
RoHS 3 & REACH SVHC <0.1%
MIL-STD-202G Method 213
Ordering Information
Option Detail
Standard Packaging 50 units/tray
Moisture Sensitivity Level 3
Lead Time 6-8 weeks
Key Advantages
High-Density Solution - 62 positions in compact footprint
Military-Grade Reliability - Exceeds MIL-SPEC requirements
Superior Signal Integrity - Controlled impedance design
Harsh Environment Ready - IP67 sealed when mated
Typical Applications
Aerospace avionics systems
Defense electronics
High-speed data transmission
Industrial automation controls
Easy Semiconductor Technology (Hong Kong) Limited 易擇半導體科技(香港)有限公司
吉ICP备2024020526号-1
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